| ADB600 Description |
| BCO Substrate - 150mm (6") |
| ADB600 Vendor |
| Analog Devices |
| ADB600 Features |
- Significant die shrink compared to conventional dielectric isolation (DI) or junction isolation
- Lower processing cost compared to trench isolation on SOI using epi
- Bulk quality top silicon layer
- Total device-to-device isolation
- Lower substrate capacitance than bulk
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| ADB600 Applications |
- Photovoltaic cells and optoelectronic components
- Solid state relays
- High voltage analog circuits for telecommunications
- High temperature electronics
- High performance bipolar processes
- Smart power ICs
- Integrated sensors
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| ADB600 Datasheet and Application Notes |
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| Products related to ADB600 |
AD7536TQ/883B ADN2859ACP-U1 AD7536ACHIPS AD60009
AD7536KP AD7536KN ADN2859 ADN2859ACP-RL7
ADN2859ACP-RL AD7536 AD7536JN ADN2859ACP
ADN2859XCP AD6484 AD60010 AD7536JP
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