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PACDN1404C

PACDN1404C Manufacturer

California Micro Devices

PACDN1404C Description

ESD Protection Arrays, 4, 8 and 16 Channel, Chip Scale Package

PACDN1404C Categories

ESD Protection

PACDN1404C Datasheet (PDF)

PACDN1404C Datasheet

PACDN1404C Price & Availability


Check PACDN1404C Price & Availability at Canics

PACDN1404C Features

  • 4, 8, or 16 transient voltage suppressors in a single package
  • In-system Electrostatic Discharge (ESD) protection to ±25kV contact discharge per IEC 61000-4-2 international standard
  • Compact Chip Scale Package (0.65mm pitch) format saves board space and eases layout in space critical applications compared to discrete solutions and traditional wire bonded packages
  • Lead-free versions available

PACDN1404C Description

    The PACDN1404C, PACDN1408C and PACDN1416C are transient voltage suppressor arrays that provide a very high level of protection for sensitive electronic components that may be subjected to ESD.



    These devices are designed and characterized to safely dissipate ESD strikes at levels well beyond the maximum requirements set forth in the IEC 61000-4-2 international standard (Level 4, ±8kV contact discharge). All I/Os are rated at ±25kV using the IEC 61000-4-2 contact discharge method. Using the MIL-STD-883D (Method 3015) specification for Human Body Model (HBM) ESD, all pins are protected for contact discharges to greater than ±30kV.



    The Chip Scale Package format of these devices enable extremely small footprints that are necessary in portable electronics such as cellular phones, PDAs, internet appliances and PCs. The large solder bumps allow for standard attachment to laminate boards without the use of underfill. The PACDN1404C, PACDN1408C and PACDN1416C are available with optional lead-free finishing.

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