PACDN2404CG

California Micro Devices

PACDN2404CG Datasheet

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The PACDN2404C, PACDN2408C and PACDN2416C are transient voltage suppressor arrays that provide a very high level of protection for sensitive electronic components that may be subjected to ESD. The back-to-back Zener connections provide ESD protection in cases where nodes with AC signals are present.



These devices are designed and characterized to safely dissipate ESD strikes at levels well beyond the maximum requirements set forth in the IEC 61000-4-2 international standard (Level 4, ±8kV contact discharge). All I/Os are rated at ±18kV using the IEC 61000-4-2 contact discharge method. Using the MIL-STD-883D (Method 3015) specification for Human Body Model (HBM) ESD, all pins are protected for contact discharges to greater than ±30kV.



The Chip Scale Package format of these devices enable extremely small footprints that are necessary in portable electronics such as cellular phones, PDAs, internet appliances and PCs. The large solder bumps allow for standard attachment to laminate boards without the use of underfill. The PACDN2404C, PACDN2408C and PACDN2416C are available with optional lead-free finishing.