74AC11004DBR Description74AC11004DBR Categories74AC11004DBR Manufacturer
74AC11004DBR Datasheet (PDF)
74AC11004DBR Price & Availability
74AC11004DBR Features- Flow-Through Architecture Optimizes PCB Layout
- Center-Pin VCC and GND Configuration Minimizes High-Speed Switching Noise
- EPIC TM (Enhanced-Performance Implanted CMOS) 1-m Process
- 500-mA Typical Latch-Up Immunity at 125°C
- Package Options Include Plastic Small-Outline (DW) and Shrink Small-Outline (DB) Packages, and Standard Plastic 300-mil DIPs (N)
74AC11004DBR Parameters
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