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74AC11008 Features- Flow-Through Architecture Optimizes PCB Layout
- Center-Pin VCC and GND Configurations Minimize High-Speed Switching Noise
- EPICTM (Enhanced-Performance Implanted CMOS) 1-m Process
- 500-mA Typical Latch-Up Immunity at 125°C
- Package Options Include Plastic Small-Outline (D) and Thin Shrink Small-Outline (PW) Packages, and Standard Plastic 300-mil DIPs (N)
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