74AC16373DL Manufacturer
74AC16373DL Description74AC16373DL Description74AC16373DL Description74AC16373DL Categories
74AC16373DL Datasheet (PDF)
74AC16373DL Price & Availability
74AC16373DL Features- Members of the Texas Instruments WidebusTM Family
- 3-State True Outputs
- Full Parallel Access for Loading
- Flow-Through Architecture Optimizes PCB Layout
- Distributed VCC and GND Pin Configuration Minimizes High-Speed Switching Noise
- EPICTM (Enhanced-Performance Implanted CMOS) 1-m Process
- 500-mA Typical Latch-Up Immunity at 125°C
- Package Options Include Plastic 300-mil Shrink Small-Outline (DL) Packages Using 25-mil Center-to-Center Pin Spacings and 380-mil Fine-Pitch Ceramic Flat (WD) Packages Using 25-mil Center-to-Center Pin Spacings
74AC16373DL Parameters
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