Member of the Texas Instruments Widebus^TM Family
EPIC^TM (Enhanced-Performance Implanted CMOS) Submicron Process
Typical V_OLP (Output Ground Bounce) < 0.8 V at V_CC = 3.3 V, T_A = 25°C
Typical V_OHV (Output V_OH Undershoot) > 2 V at V_CC = 3.3 V, T_A = 25°C
Latch-Up Performance Exceeds 250 mA Per JEDEC Standard JESD-17
Bus Hold on Data Inputs Eliminates the Need for External Pullup/Pulldown Resistors
Package Options Include Plastic 300-mil Shrink Small-Outline (DL) and Thin Shrink Small-Outline (DGG) Packages EPIC and Widebus are trademarks of Texas Instruments Incorporated.

SN74LVC16373DL Parameters

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